SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.
HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...
More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field. Advanced packaging may be the best way forward for massive ...
Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...
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