As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

According to projections from Towards Packaging, the global advanced packaging market is set to increase from USD 43.04 ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Fan-Out Wafer Level Packaging (FOWLP) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to ...

In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.