Infineon Technologies AG has introduced its new 'Coil on Module' chip package for Dual Interface bank and credit cards, which are used for both contact-based and contactless applications. The new ...
Infineon Technologies AG today announced the availability of its "Coil on Module" (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results