The latest addition to its Narrow Pixel Pitch (NPP) product family brings tighter pixel spacings with increased durability. When you purchase through links on our site, we may earn an affiliate ...
For securing packages such as BGAs and CSPs as well as larger ASICs and microprocessors, the Hysol FP4581 and Hysol FP4583 liquid epoxy encapsulants perform as underfills for flip chip devices. The ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
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