LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...

Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...

Fig. 1. Trade-off between fidelity/accuracy and simulation time for different solutions providing thermo-chemical analysis of composite parts during processing. Photo Credit: Convergent Manufacturing ...

Ansys announced that it has obtained certification for thermal and multiphysics verification tools for advanced semiconductor designs manufactured using Intel's 18A (1.8-nanometer) process technology.

The big challenge of composite design is to develop a part that will satisfy geometric tolerances and performance requirements (e.g., weight, thermal and mechanical behaviors). Today, even if sizing ...

eWEEK content and product recommendations are editorially independent. We may make money when you click on links to our partners. Learn More. As the business motivation for new IT projects rises ...

Bolstered by fast processing speeds and cheap memory, simulation has become far more accessible than in the past. Thus, the development tool has transformed product development. Simulation has ...