The challenge of minimizing risks from chemical contaminants in food packaging just got easier. New research from Iowa State University pulls together regulated and restricted chemical substances in a ...

Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...

The 2023 Inaugural Student and Faculty Research Program—"Keep It Fresh!"— is a collaboration between RIT, Binghamton University, Clarkson University, and Cornell University. The program enables ...

Industry leaders explore how packaging can restore ecosystems and support circular manufacturing at Anaheim conference.

The Pentawards has released its annual report unveiling the top packaging design trends set to take over 2025. With cultural shifts, changing consumer habits and an increased focus on environmentalism ...

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators, according to ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...