Researchers have developed a stacking technology for a magneto-resistive random access memory (MRAM) to separately form a single-crystal tunnel magnetoresistive (TMR) thin film and then bond it to a ...
Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of ...
(Nanowerk News) The magnetic, conductive and optical properties of complex oxides make them key to components of next-generation electronics used for data storage, sensing, energy technologies, ...
A nanoelectronics research institute has announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology. Scientists recently demonstrated the first functional 3D integrated ...
Plastic deformation in metals and alloys is governed by the generation and evolution of defects of point, line, plane and volume types 1,2. Among these defects, stacking fault tetrahedra (SFT), ...
Stacking ultrathin complex oxide single-crystal layers allows researchers to create new structures with hybrid properties and multiple functions. Now, using a new platform, researchers will be able to ...
MADISON, Wis. -- The magnetic, conductive and optical properties of complex oxides make them key to components of next-generation electronics used for data storage, sensing, energy technologies, ...
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