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TSMC SVP Kevin Zhang opens up on process technology development & evolving demands: Interview
We had the opportunity to interview TSMC's Kevin Zhang, the deputy co-COO and SVP at TSMC, to discuss the latest trends in the semiconductor industry and how they impact TSMC's strategy moving forward ...
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TSMC expands investments in the U.S. to $165 billion with new fabs and R&D center: A closer look
On Monday, TSMC announced plans to invest $100 billion in expanding its U.S. manufacturing capacity. The funds will go toward three additional fabs, two advanced packaging plants, and a major R&D ...
HAIFA, Israel--(BUSINESS WIRE)--proteanTecs®, a global leader in advanced analytics for semiconductor health and performance monitoring, today announced the successful silicon-proven validation of its ...
Companies Strengthen Collaboration with Successful Tape Out of HBM Customer Design, Certified EDA Flows, and PPA-Optimized IP on Samsung's Advanced Technologies "The adoption of Edge AI applications ...
Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...
PITTSBURGH, April 30, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys ...
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April, and the upcoming ...
A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image ...
Large language models (LLMs like ChatGPT) are driving the rapid expansion of data center AI capacity and performance. More capable LLM models drive demand and need more compute. AI data centers ...
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