New joint composable solutions deliver software-defined, low-latency data centers with the ability to pool and orchestrate for DRAM-like data speeds. Liqid, the world’s leading software company ...

Intel (NASDAQ:INTC) has launched its next-generation enterprise AI solutions Xeon 6 and Gaudi 3, potentially looking to challenge Nvidia's (NVDA) dominance in the field. Intel's stock was up about 2% ...

Intel has released a new video showing off its advanced packaging technologies. The goal of the video seems to be to attract customers to its Intel Foundry Services (IFS) business by letting the world ...

Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Astera Labs, the global leader in semiconductor-based connectivity solutions for AI infrastructure, today announced that its Leo Memory Connectivity Platform ...

TL;DR: Intel CEO Pat Gelsinger stated that the use of on-package memory with Lunar Lake CPUs was a one-time decision due to its impact on gross margins. Future CPUs, including Panther Lake and Nova ...

TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...

Compute Express Link, or CXL, has only been in use for five years, yet it is already having an impact in connecting server components. The technology, introduced by Intel Corp. in 2019 and designed as ...

A new technical paper titled “On-Package Memory with Universal Chiplet Interconnect Express (UCIe): A Low Power, High Bandwidth, Low Latency and Low Cost Approach” was published by researchers at ...