Timely and effective development of system-in-package (SiP) alternatives has driven the need for broader supplier collaboration on system-partitioning decisions within the electronics food chain.

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...