After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...
Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...
HFM FPGA Module Standard arrives with solderable and connector variants, aiming to cut board redesign time and vendor lock-in ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
A new class of compact compute module integrates heterogeneous processing with industrial-grade resilience, tackling ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
The SGET announced a paradigm shift in embedded design with the official release of the Open Harmonised FPGA Module (oHFM) ...
The Standardisation Group for Embedded Technologies (SGET) heralds a paradigm shift in embedded design: With the publication ...
I Squared Capital has launched ANZA Power, a new IPP aiming to deliver reliable and sustainable energy across Australia & New ...
The 18th World Future Energy Summit & Exhibition (WFES 2026) was grandly held at the Abu Dhabi National Exhibition Centre ...
ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.
Artificial intelligence (AI) solution provider Innodisk has announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc. The flagship ...
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