The EPC2366 40 V eGaN® FET sets new benchmarks in performance, efficiency, and power density for next-generation power ...

For more than a decade, a supposedly “miracle” ultrathin insulator for electronics promised to rewrite the rules of chip ...

An ancient, fundamental cooling technique gets a new, more-efficient implementation via an innovative fiber matrix.

Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

New subsidiary to focus on advanced semiconductor packaging for defence and strategic electronics – Paras would be setting up India’s first advanced heterogeneous & 3D packaging ...

In a Nature Communications study, researchers from China have developed an error-aware probabilistic update (EaPU) method ...

Bloom Energy , a global leader in power solutions, released its latest Data Center Power Report, which surveyed ...

BW reports from Las Vegas on why CES 2026 marked the moment silicon efficiency caught up with AI ambition—turning the hype ...

I've just started testing the new Asus Zenbook Duo — the first ever Intel Core Ultra X9 388H laptop. For Tom's Guide's first ...

Keysight Technologies has launched a new Machine Learning Toolkit within its Device Modelling Software Suite, designed to ...

Keysight Technologies has introduced a new Machine Learning Toolkit as part of its latest Device Modelling Software Suite, ...