Abstract: Ultrasonic wire bonding is one of the critical challenges for power semiconductor manufacturing process, especially for silicon carbide (SiC) power devices. Packaging-related strain on the ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...

There’s always a strange joy in watching virtual money go up. Business simulation games have a special kind of magic. What ...